In-line
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PASTE ON PAD VERIFICATION
Paste on Pad Verification is an automatic print
verification technology that operates at the line beat rate.
This option assesses 100% of printed boards and gives a very fast go/no-go indication for
each. Faulty boards can now be automatically isolated in real time.
EASY SETUP & VERIFICATION
The user can program to verify only certain areas of
the board, for example where print deposit density may be particularly high. This allows
the user to adjust the total verification cycle time if necessary, and to derive maximum
value from the system within the line beat rate.
Speed in production is important, but this has also revolutionised the set-up such that it
is easier and quicker to achieve the benefits of this new verification technology.
In production, Paste on Pad Verification provides immediate feedback of problems as they
occur and gives the line technician simple recovery choices.
| USING GRAPHICAL
INTERFACE
![bullet_sq.gif (857 bytes)]()
Easily defined scan areas are programmed using the trackerball.
![bullet_sq.gif (857 bytes)]() These can be key devices
or even the whole substrate.
![bullet_sq.gif (857 bytes)]() Interface is simple to
navigate and setup takes seconds.
SIMPLE FEEDBACK TO OPERATOR
![bullet_sq.gif (857 bytes)]()
Real time graphical reporting is displayed.
![bullet_sq.gif (857 bytes)]() Least pasted site is
automatically shown.
![bullet_sq.gif (857 bytes)]() Adjustments and recovery
actions made real time before going downline.
|
|
THE SPEED
| Device Type |
Pitch |
Paste On Pad Verification |
| QFP 160 |
0.65mm |
2,6 |
| QFP 208 |
0.5mm |
2,6 |
| QFP 256 |
0.4mm |
2,6 |
| |
|
|
| PLCC 28 |
1.27mm |
1.0 |
| TSOP 32 |
0.5mm |
0.4 |
| |
|
|
| BGA 196 |
1.27mm |
1.0 |
| BGA 225 |
1.5mm |
2,6 |
| BGA 361 |
1.0mm |
2,6 |
| BGA 361 |
0.5mm |
0.6 |
| |
|
|
| BGA 2025 |
0.635mm |
2,6 |
|
|
|
